Note
from the Director
The course descriptions presented herein are
provided for convenience. However, they are subject
to change. Students can consult with the instructor
regarding the descriptions. Students should search
and/or verify course availabilities and schedules
by reviewing the UNM
web link . For additional course descriptions,
see the SCHOOL OF ENGINEERING within the UNM CATALOG. |
ChNE 586
- Statistical Design of Experiments
for Semiconductor Manufacturing
This course consists of two self-contained
modules. The first module covers each of the major integrated
circuit processing methods, i.e., photolithography,
etching, film growth and deposition, ion implantation,
chemical mechanical polishing, and various support activities
such as wafer cleaning. The second module covers the
statistical tools for collection, analysis, and interpretation
of data with emphasis on design and control of semiconductor
processes. These include analysis of variance, Taguchi
design, and utilization of RS/1 software. (3Hr)
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CS 492 -
Computers in Manufacturing
This course is intended to provide an
understanding and appreciation of the concepts, technology,
and considerations associated with using computers in
manufacturing facilities. To provide context, an overview
of prototypical manufacturing operations and associated
information and control needs are examined. Technical
topics studied in detail are: digital computer systems,
networks, distributed systems, software and hardware
appraisal and selection, application development, data
collection and analysis, and quality control. A team
project is required and excellent laboratory facilities
are available. A typical project includes an application
program developed by a team that provides a user interface
and high-level control. A network will connect the PC
running the application program to a local real-time
controller consisting of a microprocessor and associated
sensors and actuators. A team will program the microprocessor.
The local controller will in turn directly control a
piece of moving equipment such as a train and/or a robot.
Instructor: Joel N. Beer, Ph.D., P.E.,
Adjunct Professor of Mechanical Engineering.
jnbeer@unm.edu or 505.272.7154
Text: Instructor provided class notes.
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ECE 487
- Semiconductor Factory Design and Operation
Course provides a detailed overview of the operations
and layout of an integrated circuit fabrication facility.
Operations topics include basic wafer fabrication steps,
tool selection, wafer tracking and handling, WIP, equipment
and process integration, process ramp-ups, operator
protocol, staffing, training, and best-practices. Fab
(plant-level) design topics include costing, overall
equipment effectiveness, construction materials, contamination
control, air handling, and factory integration. Utility
topics include ultrapure water, bulk and specialty gases,
electricity minimization, waste stream design, recycling,
and ESH requirements. Detailed tours of Sandia's Microelectronics
Development Lab and discussions with fab engineers will
be included in the course.
Instructor: Blewer and Weaver
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ECE 526
- Microelectronic Reliability
General: CMOS integrated circuit reliability
is a complex subject and this course uses several experts
from industry to provide depth and breadth of several
areas listed below.
Prerequisites: basic knowledge of transistor
devices (MOSFET) and CMOS IC technology. Students obtain
this either through the university curriculums, industrial
experience, or both.
Grading: mid-term, final exam and a
term paper related to electronic failure analysis.
Text: There is no text covering all
of the material. The material comes from PowerPoint
notes from each lecturer loaded on a UNM web site.
Topic List: Microelectronic reliability
failure mechanisms including:
• metal electromigration
• metal stress voiding
• oxide wearout
• oxide hot carrier injection
• IC packaging reliability
• qualification testing
• reliability statistics
• radiation effects
• EOS/ESD
• wafer level reliability
• new material reliability
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ECE 527
- Microelectronic Failure Analysis
This graduate course is a joint venture of the University
of New Mexico (UNM), Sandia National Labs, and the Product
Analysis Forum (PAF) of Sematech. The participating
lecturers are from companies such as, AMD, Analytical
Solutions, Ford/Visteon Microelectronics, Infineon,
IBM, Intel, NIST, Sandia National Labs, Texas Instruments,
and the University of New Mexico (UNM). The course was
conceived to fill a void in university teaching of failure
analysis and to allow experts from industry to participate
in the course layout. The planning committee decides
the best sequence of topics for the lectures and then
invites persons from around the United States to give
those lectures from the classroom in New Mexico.
Prerequisites: basic knowledge of
transistor devices (MOSFET) and IC technology. Students
obtain this either through the university curriculums,
industrial experience, or both.
Grading: mid-term, final exam and a
term paper related to electronic failure analysis.
Text: "Failure Analysis of Integrated
Circuits - Tools and Techniques" by Lawrence C.
Wagner, Kluwer Academic Pub, 1999.
Topic List includes:
• Failure Analysis (FA) Process and Decision-Making
• CMOS IC Electrical Testing and Characterization
• Package Analysis
• Depackaging, Including Backside Preparation
• ATE and Characterization of Failure Modes
• GFI (Global Fault Isolation)(: RCI, CIVA, LECIVA,
EBIC, OBIC, LIVA, TIVA, SEI, Photoemission, Thermal
• Inspection Technology
• Diagnosis, Signature Analysis, SW failure isolation,
Testability
• LFI (Local Fault Isolation): Electrical and
Mechanical Probing, E-Beam, Laser Probing, Time-Resolved
Photon Emission Analysis, High Resolution SPM
• Deprocessing
• Focused Ion Beam (FIB) Theory and Applications
• EOS/ESD Defects and Characterization
• SIMS, Micro-spot FTIR
• FA Lab Management
• Failure Analysis & Diagnosis Future: Needs,
Challenges
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ECE 528
- Microelectronic Test Engineering
General: CMOS integrated circuit test
engineering is possibly the most expensive component
in the life cycle of an IC. This course uniquely teaches
the interplay of the digital and mixed-signal automatic
test equipment with the modern design-for-test concepts
necessary to cost effectively achieve testability.
Prerequisites: basic knowledge of transistor
devices (MOSFET) and CMOS IC technology. Students obtain
this either through the university curriculums, industrial
experience, or both.
Grading: mid-term, final exam, and
a term paper related to electronic failure analysis.
Text (2): "Fundamentals of Digital Semiconductor
Testing " by Guy Perry, Soft-Test Inc.
"Fundamentals of Mixed Signal Testing" by
Soft-Test Inc
See web site for book purchase at http://www.soft-test.com
Topic List: Microelectronic test engineering
topics are:
• test economics
• types of test
• AC/DC parametrics
• IDDQ testing
• memory testing
• ATE architecture
• faults and defects
• design for test
• Systems-on-Chip (SoC) testability
• board testing and IEEE standards
• mixed signal testing
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ECE 529
- Semiconductor Process Integration and Test
This course consists of two self-contained modules.
The first module introduces methods for integrating
individual semiconductor processes into a modern technology.
Links between the processes and techniques for insuring
compatibility are studied. The second module covers
topics in testing, both devices and circuits. A major
topic is parametric tests that study test structures
and are carried out during fabrication. (3Hr)
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ECE 574L - Microelectronics Proc I
Materials science of semiconductors, microelectronics
technologies, device/circuit fabrication, parasitics
and packaging. Lab project features small group design/fabrication/testing
of a simple MOS circuit.
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ECE 579
- Topics in Advanced Microelectronic Processing
Topics in Advanced Microelectronic Processing ECE
579-001 on M/W in ECE Bldg. Room 310, Spring
Instructor: Robert S. Blewer
COURSE OBJECTIVES:
(1) To give students a working knowledge about the most
recent advances in the rapidly changing areas of advanced
semiconductor fabrication technology.
(2) To qualify graduates to successfully compete for
engineering positions in industry in multilevel interconnected
and related technologies, which represent some of the
most significant challenges in integrated circuit R&D
and manufacturing today.
BACKGROUND:
IC processing advances are being driven at an amazing
pace by industry competition for higher device performance.
To meet increasingly demanding on-chip interconnect
requirements, new materials and film deposition techniques
are being introduced with each succeeding generation
of devices. Low resistivity metals and ultra-low dielectric
constant insulators are now being used to reduce signal
delays in multilevel interconnect layers. Combinations
of electrochemical deposited copper, sputtered aluminum,
and chemical vapor deposited tungsten are required to
meet geometrical, performance, yield, manufacturability
and reliability requirements. To realize gigahertz microprocessor
production, these and other advanced techniques will
be required.
Through this course, an opportunity exists to learn
about state of the art processing trends and how to
apply these principles to excel in microelectronics
processing.
Call 844-6125 for Topical Course Outline and Class
Format information.
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ECE 595
- MEMS and Transducers
Development and Technology
The goals of this course is to introduce students to
MEMS devices, microsystems and their applications. The
course will start with an introduction on the mechanical
and electrical properties of materials commonly used
in MEMS. The micro-fabrication processes, including
bulk and surface micromachining processes for realization
of these micro/nano transducers will be discussed, along
with integration of MEMS with CMOS electronics. Some
representative sensors and actuators, including capacitive
& piezoelectric pressure sensors, mechanical resonators
and filters, minimally invasive implantable medical
devices, and biomedical lab-on-a-chip will be used to
illustrate the capabilities & advantages of these
miniaturized devices. Smart microfluidic devices will
be used to illustrate how MEMS technology provides a
unique channel to cellular level treatment & diagnosis.
This course includes a design project, using 2-layer
polysilicon MUMP process to design a MEMS transducer
of student's own choice. This course also includes a
lab session for students to fabricate a multichannel
drug delivery silicon probe using UNM’s MTTC cleanroom
facility.
Prerequisites: Senior or graduate
standing in Engineering or any Physical Science, or
permission of the instructor.
Instructor: Professor Jingkuang Chen,
jingchen@ece.unm.edu
Text: " Micromachined Transducers
Sourcebook " by Gregory Kovacs.
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ME 456 -
Entrepreneurial Engineering
The course is aimed at working engineers and scientists
as well as graduate and undergraduate engineering students
who wish to be better prepared to start successful new
businesses if and when they may choose. Class members
are invited to propose potential businesses, then divide
into groups of about four each to develop business plans
by the end of the semester. The class focuses upon marketing,
finance, legal, manufacturing and management tools,
resources and skills that increase the probability of
successfully starting and growing a new company.
Instructor: Dr. Bill Gross
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ME 483/583 - Statistical
Methods for Improving Product Quality
The purpose of this class will be to develop and illustrate
statistical methods that can be used by people involved
in areas where data are collected and analyzed in order
to understand how processes operate. Such areas include
business, engineering and science. The class will begin
with an introduction to basic probability and statistical
concepts. Common probability distributions and their
characteristics and applications will be presented.
Concepts of statistical tests of significance and confidence
intervals will be presented. Probability theory will
be presented by application to reliability analysis
for parallel and series systems. This introduction will
be followed by topics in acceptance sampling, statistical
process control (SPC), process capability, concepts
of design of experiments, comparative experiments, full
factorial and fractional factorial experiments, and
response surface methodology. Each of these topics will
be illustrated with application to real world examples.
The emphasis of this course will be on the effective
and technically accurate implementation of the statistical
techniques rather than their mathematical development.
Statistical software will be used for the data analyses.
The student will use any software they desire. The instructor
will use JMP software which is available in the ME computer
lab. There will be one exam and three projects assigned.
Project #1 will be an individual project on statistical
process control and process capability. It will be required
that each student propose a SPC program for implementation
for a specified manufacturing process. A report for
technical management responsible for the process will
be prepared. Project #2 will be a team project on design
of experiments. The application of factorials experiments
and response surface methodology will be the focus of
the project. The purpose of this project will be design
and analyze a series of experiments in order to determine
the optimal operating conditions for the process. Project
# 3, selected by the students, will be an application
of statistical concepts to any area of the student’s
interest.
Instructor: Dr. Richard Prairie.
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ME 487/587 - LEGO™
Robotics
Design and construction of an autonomous, microcomputer-controlled
mobile robot using LEGO pieces and assorted electromechanical
actuators and sensors. Students work in teams, and robots
compete at the end of the semester. For more info, go
to the ME
LEGO Robotics Page .
Instructor: Dr. Greg Starr
Text: Course notes provided by Instructor
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ME 488/588 - Design and
Manufacturing in Industry
Course will consist of one three-hour site visit per
week, to local companies and laboratories, to examine
design and manufacturing techniques. Each site visit
will consist of a one-hour tutorial about the company
or lab and its manufacturing methods. The tutorial is
to be followed by a two-hour tour through the facility.
A term paper, and at least two classroom presentations
by the student are expected. Occasionally, additional
lectures will be provided on a scheduled basis. No exams.
Enrollment limited (12). Senior or Graduate status required.
Transportation not provided. Regular Class Meeting:
Fridays, 1:00 - 3:50 pm, at company sites.
Instructor: Prof. J. Wood ME 206,
phone: 505-277-1420,
fax: 505-277-7281, email: wood@me.unm.edu
Text: J.R. Dixon and C. Poli, Engineering Design
and Design for Manufacturing, 1995, Field Stone Publishers,
Conway, MA (ISBN: 0-9645272-0-0).
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ME 547 -
Principles of Precision Engineering
Lectures and laboratory projects emphasizing precision
engineering in advanced manufacturing. We will address
sub-micron, microinch, and nanometer resolution and
repeatability; some of the applications for ultraprecision
systems (emphasis on semiconductor lithography equipment)
and the design of instruments to achieve accurate metrology
and repeatable performance. Students will work in teams
on a term project (drawn from industrial or academic
research) to put into practice what they have learned
in the course.
Instructor: TBD
Text: Ultraprecision Mechanism Design,
Stuart Smith.
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ME 574 -Modeling, Simulation,
& Synthesis of Electromechanical Control
Computer-aided simulation of dynamic systems and design
of control systems. Design of actuators and sensors;
linearization techniques; scaling. Performance criteria,
robustness, state-space design. Synthesis through hardware
implementation of an electromechanical control system.
Instructor: TBD
Text: Art of Electronics, Horowitz & Hill.
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ME 584 -
Computer Aided Design
Implementation of CAD/CAM in automated manufacturing
systems, laboratory work on CAD solid modeling software.
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ME 585 - Modern Manufacturing
Methods
First, a number of manufacturing approaches are explored
including the concepts of "push" and "pull"
manufacturing, just in time (JIT) manufacturing, Kanban,
and continuous flow manufacturing. Then, assembly lines
are modeled and analyzed. These lines are first modeled
as reliable systems, then extended to the more realistic
case where failures are taken into account. Other topics
include: shop floor scheduling, flexible manufacturing
systems, facility layout, material-handling systems,
queuing, and warehousing. The concept of quality, shown
in both Taguchi methods and the "house of quality"
is also explored. The student will understand all of
the terms in modern manufacturing and will be prepared
to apply this knowledge to real problems. A term-project
that ties these concepts together is required.
Instructor: Dr. Ron Lumia ME 319 272-7155
(office) email: lumia@me.unm.edu
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ME 586 - Design for Manufacturability
It has been claimed that 80% of the ultimate cost to
produce a product is the direct result of the design.
In this course, we will explore various techniques that
make a product design manufacturable. Topics will include
design as part of the manufacturing process, concurrent
engineering, quality measures, manual and robotic assembly
techniques, materials and processes, rules for design,
life cycle and environmental concerns, and tools that
help to analyze and measure designs quantitatively.
A significant component of the course is the project,
specified and executed by a student team.
Instructor: Dr. Ron Lumia ME 319 272-7155
(office) email: lumia@me.unm.edu
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ME 589 - Intelligent Controls
in Manufacturing
This course emphasizes the state of the art in factory
automation and computer integrated manufacturing (CIM)
by focusing on software issues. Hierarchical control
system architectures are explored along with automation
applications for factories and robots. Case studies
of existing automated facilities will be used to explore
topics including: hierarchical control of factories,
alternative control architectures, implementing open
architecture controllers, off-line programming of equipment,
planning for CIM, quality measurement, and production
design systems. The final learning outcome of this course
is that each student should have the ability to organize
and implement the software that can control a machine,
a grouping of machines as a workcell, or a grouping
of workcells as a factory.
A term project, a substantial part of the course, will
be assigned. The topic will relate to software architectures
for manufacturing. The class will divide into teams
to solve the problem. These teams should be formed strategically
so that complementary skills are represented. Progress
toward the successful completion of the project will
be presented periodically in class, e.g., preliminary
design review (PDR), critical design review (CDR), etc.
Instructor: Dr. Ron Lumia ME 319 272-7155
(office) email: lumia@me.unm.edu
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MGT-504
- Microeconomics for Managers
This is a course in microeconomics, which is the study
of individual decision making in a world in which wants
exceed available resources.
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MGT - 506.
Organizational Behavior and Diversity
Intensive examination of behavioral science research
and theory as a basis for understanding, managing and
changing organizations. The course emphasizes effective
management with diverse individuals.
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MGT 521
- Manufacturing Systems Management
An introduction to the principles and techniques necessary
for the efficient design and operation of production
and inventory planning, scheduling, and control systems.
Topics include master planning, capacity management,
inventory control, production activity control, JIT,
MRP, and synchronous manufacturing.
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